The production technology of SMD capacitors and electronic components is the key to its quality. A good product can bring a good reputation, and it is also the responsibility for product quality. Patch capacitor is widely used in electronic industry, and many people know that its core is incomprehensible. The following contents are related to the seventeen steps of "Production Process Flow" of SMD capacitors compiled by Shunhai Technology for reference.
The step of "production process flow" of SMD capacitor is interpreted as follows
First, ingredients
Analysis: the key part of ceramic powder batching (raw materials determine the performance of programmable controllers);
Second, ball milling
Analysis: ball mill (after about 2-3 days, the diameter of ceramic batch particles will reach micron level);
Third, ingredients
Analysis: various ingredients are mixed according to a certain proportion;
IV. Mixing slurry
Analysis: Additives make the mixed materials pasty;
V. Flow along
Analysis: evenly spread the paste slurry on the film (the film is a special material to ensure a flat surface);
VI. Printed electrodes
Analysis: the electrode material is printed on the flowing paste according to certain rules (ensure that the electrode layer is dislocated in the process, and the size of different MLCC is guaranteed by the process);
VII. Lamination
Analysis: according to the different capacity values, the flow of printed electrodes is superimposed along the slurry block to form a capacitor blank plate (the capacitance value of specific size is determined by different layers);
VIII. Lamination
Analysis: make the multi-layer blank plates closely combined;
Nine, cutting
Analysis: cutting the blank into monomer blanks;
Ten, glue discharge
Analysis: Remove the adhesive for bonding raw materials at a high temperature of 390 degrees Celsius;
XI. Roasting
Analysis: Ceramic powder is fired into ceramic materials at a high temperature of 1300 degrees Celsius to form ceramic particles (this process lasts for several days, and if the temperature control is not good during the baking process, it is easy to produce capacitive embrittlement);
XII. Chamfering
Analysis: grinding off the edges and corners of the cuboid, exposing the electrodes and forming chamfered ceramic particles;
XIII. Sealing
Analysis: stand up the chamfered ceramic particles exposed to the electrode, seal the broken ends with copper or silver materials to form copper (or silver) electrodes, and connect the electrode plates to form closed ceramic particles (this technology determines capacitors);
XIV. Burning End
Analysis: Put the capped ceramic particles into a high-temperature furnace to sinter the copper (or silver) electrode, and form a ceramic capacitor initial body that is in close contact with the electrode plate;
XV. Electroplating
Analysis: Using electroplating technology, stop nickel plating and then tin plating. Nickel is the termination between barrier layers and tin plating. Tin is used to prevent nickel oxidation;
XVI. Testing
Analysis: Use special tools to test and sort values to test whether special capacitors are qualified. Four indexes that must be tested in this process: withstand voltage, capacitance, DF value loss, leakage current transmission and insulation resistance transmission (the process distinguishes the withstand voltage value of capacitor and the accuracy of capacitor, etc.);
XVII. Banding
Analysis: according to the requirements of size and quantity, package the capacitor in paper tape or plastic bag;
Conclusion: The production process of SMD capacitor is very strict, and every detail is the key that can not be ignored. The manufacturing process of the patch capacitor is very complicated and involves many steps. If you are not a professional, it is difficult to understand its production process. Any details must strictly follow the production technology, so as to ensure the accuracy of details, the quality of capacitors and the small error of capacitors.
