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Introduction to Size Parameters of 0805 Resistance Packaging

Date: 2024-04-26 Viewed:544

In the field of electronic components, 0805 packaging is a very common surface mount (SMT) packaging form. Its size standard is 5mm x 5mm x 0.65mm, which means the length, width, and height are 5mm, 5mm, and 0.65mm respectively. However, behind this seemingly simple number, there are many unknown mysteries hidden. This article will reveal the mystery of 0805 packaging size from the following aspects:

The Historical Evolution of 0805 Packaging

0805 packaging originated in the 1980s, when integrated circuits (ICs) were in a period of rapid development. In order to meet the continuous upgrading needs of electronic products, electronic component manufacturers have begun to explore smaller, lighter, faster, and more energy-efficient packaging forms. In this context, 0805 packaging emerged. Its emergence has greatly promoted the development of electronic products, enabling various miniaturized electronic devices to be realized

Design concept of 0805 packaging

The design concept of 0805 packaging mainly includes the following points:

1 High Integration: The 0805 package adopts a three-layer structure, with the top layer being a plastic insulation layer, the middle layer being a copper foil circuit layer, and the bottom layer being a soldered terminal. This structure makes the entire package very compact, enabling high-density integration

2 Good electrical performance: Due to the use of copper foil circuit layer in the 0805 package, it has good conductivity and mechanical properties. Meanwhile, the plastic insulation layer can effectively prevent interference from external electromagnetic waves on integrated circuits

3 Easy to install and test: The small size of the 0805 package makes it very suitable for surface mount technology. In addition, due to its compact structure, it can be easily welded and repaired

Size standard for 0805 packaging

Although the size of the 0805 package is only 5mm x 5mm x 0.65mm, its actual size is subject to certain limitations. This is mainly determined by the following factors:

1 Pin spacing: The standard pin spacing for the 0805 package is 1.27mm, as this spacing allows for optimal electrical and mechanical performance. If the pin spacing is too large or too small, it may cause problems such as poor welding or mechanical damage

2 Process tolerance: In the actual production process, in order to ensure the quality and performance of packaging, it is necessary to control the process parameters with certain tolerances. These tolerances include dimensional tolerances, positional tolerances, etc., which can affect the actual dimensions and electrical performance of the package

3 Material performance: Although theoretically any metal material can be used for 0805 packaging, in reality, factors such as the thermal expansion coefficient and conductivity of the material also need to be considered. These factors can affect the size changes and electrical performance of packaging at different temperatures

Application areas of 0805 packaging

Due to its advantages such as small size, light weight, and superior performance, 0805 packaging is widely used in various electronic products. Here are some typical application scenarios:

1 Microcontroller (MCU): Due to the need for communication and control with external devices, a miniaturized packaging form is required. The 0805 package perfectly meets this requirement and can achieve high performance and low power consumption

2 Wireless Sensor Module (WSN): WSN typically needs to be deployed in various environments, such as soil, water sources, air, etc. In order to reduce the volume and weight of the device, it is necessary to use miniaturized packaging forms. The 0805 package can meet this requirement while also having good protective performance

3 Power Management Chip (PMIC): As the core component of a circuit, PMIC needs to have the characteristics of high performance and low power consumption. Due to the relatively low power consumption of devices such as MCU and WSN, PMICs packaged in 0805 can be used to meet this requirement

The mystery of the 0805 packaging size lies in its compact structure, good electrical performance, and wide range of applications. By gaining a deeper understanding of this small packaging form, we can better understand the world of electronic components and bring more convenience and innovation to our lives


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